wire bonding造句

Ultrasonic wire bonding between Au contact electrode of CdZnTe wafer and down-lead wire

The bonding plan which made by process engineers according to pads with different sizes greatly influences the wire bonding quality.

Design of welding pressure control system for ultrasonic gold wire bonding machine

The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.

The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.

Thermal-structural analysis was performed for ultrasonic wire bonding(UWB) by three dimensional finite element method(FEM).

It is difficult to guarantee the quality by earlier checking, so the wire bonding is one of the key factors affecting the SAW filter's performance and reliability.

Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.

If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.