silicon wafer造句

Normally silicon wafers are cut from a larger piece of silicon. This wastes about half of the wafer material.

A silicon wafer chip manufacturer tries to close a deal with a solvent service company.

The new device is a silicon wafer about the shape and size of a playing card.

The impurity of iron is one major heavy-metal contamination on the silicon wafer. Surface photo-voltage method(SPV) can be used to accurately measure the iron contamination within the silicon wafer.

Indeed, the silicon wafer itself is cut from a large rod of silicon, which is grown from a single crystal, and so is itself a single crystal.

Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.

To make its artificial leaf, the MIT team spread its catalysts on opposite sides of a silicon wafer.

A disruption in silicon wafer production can then stall makers of memory chips and, ultimately, consumer products.

A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate;

The final Ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.

Lithography, as used in the manufacture of ICs, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer.

The Suntech researchers developed a way to chemically treat the silicon wafer in narrow bands. These treated areas attract silver, which forms metal lines just 20 micrometers wide.

By splitting a laser beam and aiming each part onto opposite sides of a polished silicon wafer, the group engineered a system of reflection and interference that traps both beams in the silicon.

Normally silicon wafers are cut from a larger piece of silicon.

Material removal characteristic of silicon wafers in chemical mechanical polishing

Among other things, he decided to buy cheap silicon wafers that had been cast aside by the semiconductor industry.

Dopants for silicon wafers are found in Groups III and V of the Periodic Table of the Elements.

These firms also produce blank silicon wafers for other chip foundries: Shin-Etsu rolls out around 1.2 million 12-inch wafers per month.

The authors improved the routine steady-state surface photovoltage method to measure minority carrier diffusion length in both sides polished silicon wafers.

The dots are synthesised in a paint-like colloidal suspension which is then coated on to silicon wafers before they are cut up into chips.